宋振銘
Overview
| Works: | 1 works in 0 publications in 0 languages | |
|---|---|---|
Titles
高溫無鉛銲點機械性質探討 = = Study on the mechanical properties of high temperature Pb-free solder joints /
by:
宋振銘; 林建志; 國立東華大學材料科學與工程學系
(Language materials, printed)
高溫無鉛銲料電化學腐蝕及氧化行為研究 = = A study on the electrochemical corrosion and oxidation behaviors of high temperature Pb-free solders /
by:
蔡齊航; 宋振銘; 國立東華大學材料科學與工程學系
(Language materials, printed)
金-銀合金型奈米粒子結構與相轉變探討 = = Study on Structural Evolution and Phase Transformation of Au-Ag Alloy Nanoparticle Deposits /
by:
陳韋廷; 宋振銘
(Language materials, printed)
Mn及Ti添加對Sn-Ag-Cu無鉛銲錫與銲點振動破壞行為探討 = = The Vibration Fracture Characteristics of Sn-Ag-Cu-(Mn,Ti)Lead-Free Solders and Joints /
by:
曾傳政; 宋振銘; 國立東華大學材料科學與工程學系
(Language materials, printed)
電路板電鍍銅箔之組織與機性特徵相關性探討 = = The relationship between microstructural characteristics and mechanical properties of electrodeposited copper foils for PCB applications /
by:
王鼎翔; 宋振銘; 國立東華大學材料科學與工程學系
(Language materials, printed)
銲點介面金屬間相機械性質之從優取向與冶金效應 = = Mechanical properties of intermetallic phases at solder joint interface–crystal orientation and metallurgical effects /
by:
黃柏融; 宋振銘; 國立東華大學材料科學與工程學系
(Language materials, printed)
添加過渡金屬元素對Sn-Ag-Cu介面生成相銲點組織與可靠度影響之研究 = = Effect of transition metal element additions on interfacialreaction products and BIT reliability of SnAgCu solder joints /
by:
劉耀仁; 宋振銘; 國立東華大學材料科學與工程學系
(Language materials, printed)
電子銲點介面金屬間化合物機械性質探討 = = Mechanical Property Evaluation of Interfacial Intermetallic Compounds in Electronic Solder Joints /
by:
蘇建偉; 宋振銘; 國立東華大學材料科學與工程學系
(Language materials, printed)
以無電鍍Ni-Zn-P做為微電子銲點底層金屬之介面組織特徵研究 = = Study on interfacial morphology of microelectronic solder joints with electroless Ni-Zn-P under bump metallization /
by:
溫家慶; 宋振銘; 國立東華大學材料科學與工程學系
(Language materials, printed)
球閘陣列無鉛銲點摔落可靠度之冶金與基材效應探討 = = Metallurgical and substrate effects on the drop test reliability of BGA Pb-free solder joints /
by:
徐福聲; 宋振銘; 國立東華大學材料科學與工程學系
(Language materials, printed)