王鼎翔
Overview
| Works: | 1 works in 0 publications in 0 languages | |
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Titles
電路板電鍍銅箔之組織與機性特徵相關性探討 = = The relationship between microstructural characteristics and mechanical properties of electrodeposited copper foils for PCB applications /
by:
王鼎翔; 宋振銘; 國立東華大學材料科學與工程學系
(Language materials, printed)