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[ subject:"Integrated circuits- Design and construction." ]
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Characterization of integrated circu...
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McKenna, Robert G.
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Characterization of integrated circuit packaging materials /
紀錄類型:
書目-語言資料,印刷品 : Monograph/item
正題名/作者:
Characterization of integrated circuit packaging materials // editors, Thomas M. Moore and Robert G. McKenna ; managing editor, Lee E. Fitzpatrick.
其他作者:
McKenna, Robert G.
出版者:
Boston :Butterworth-Heinemann, : c1993.,
面頁冊數:
xviii, 274 p. :ill. ;24 cm.
叢書名:
Materials characterization series
標題:
Electronic packaging - Materials. -
ISBN:
0750692677
Characterization of integrated circuit packaging materials /
Characterization of integrated circuit packaging materials /
editors, Thomas M. Moore and Robert G. McKenna ; managing editor, Lee E. Fitzpatrick. - Boston :Butterworth-Heinemann,c1993. - xviii, 274 p. :ill. ;24 cm. - Materials characterization series.
Includes bibliographical references and index.
ISBN: 0750692677
LCCN: 93007685Subjects--Topical Terms:
669442
Electronic packaging
--Materials.
LC Class. No.: TK7870.15 / .C52 1993
Dewey Class. No.: 621.381/046
Characterization of integrated circuit packaging materials /
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c1993.
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xviii, 274 p. :
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24 cm.
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Materials characterization series
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Includes bibliographical references and index.
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六樓西文書區HC-Z(6F Western Language Books)
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