The 3rd IMPACT, the 10th EMAP joint ...
International microsystems, packings, assembly and circuits technology conference ((2008 :)

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  • The 3rd IMPACT, the 10th EMAP joint conference proceedings : = (EMAP2008) : Oct. 22-24, 2008, Taipei /
  • 紀錄類型: 書目-語言資料,印刷品 : Monograph/item
    正題名/作者: The 3rd IMPACT, the 10th EMAP joint conference proceedings :/ organized by IMPACT, EMAP & IEEE.
    其他題名: (EMAP2008) : Oct. 22-24, 2008, Taipei /
    其他題名: EMAP2008.
    團體作者: International microsystems, packings, assembly and circuits technology conference
    出版者: Taipei :IEEE, : c2008.,
    面頁冊數: 1張光碟片 :有聲, 彩色 ;4 3/4吋.
    附註: Includes advertising material.
    標題: Electronic packaging - Congresses. -
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