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良率

Overview

Works:	1 works in 0 publications in 0 languages

Titles

三維積體電路矽穿孔之內建自我測試與內建自我修復研究設計 = = Built-In Self-Test and Built-In Self-Repair Design for TSV-based 3D IC / by: (Language materials, printed)

Subjects

矽穿孔

內建自我修復

額外面積成本

內建自我測試

三維積體電路

良率

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